|Virtual Bookstore Citation|
INTELLIGENT FINITE ELEMENT SUBMODELING OF MULTICHIP MODULES FOR RELIABILITY ANALYSIS.
Grosse, Ian R.; Sheehy, Michael; Katragadda, Prasanna; Raman, Shankar
MASSACHUSETTS UNIV AMHERST DEPT OF MECHANICAL ENGINEERING
Modeling methodologies were developed, implemented, and tested forboth rapid thermal finite element analysis of small-scale integrated circuitfeatures in MCMs, and for thermal stress finite element analysis of chip-to-substrate interconnects. A three-step
|Price: $9.95 Available as PDF for download.|| |
|Prices are plus sales tax when purchased within New York State and shipping charges, if applicable|