Virtual Bookstore Citation Title RELIABILITY STUDY OF PLASTIC ENCAPSULATED COPPER LEAD FRAME/EPOXY DIEATTACH PACKAGING SYSTEM, Author(s) Howell,J. R. ; Corporate Author(s) Report Date 4/7/1981 Page Count 7 Abstract This paper presents the evaluation methods used to appraise thereliability of plastic/copper lead frame packaging systems. A discussion of thecopper/epoxy system, suspected failure mechanisms, tests designed to explorethese mechanisms, and data developed during this study are presented. The datapresented indicates the copper/epoxy system can meet or exceed the reliabilityof the Alloy 42 system. (Author). Out Of Print Prices are plus sales tax when purchased within New York State and shipping charges, if applicable