Virtual Bookstore Citation Title HIGH-RELIABILITY, LOW-COST INTEGRATED CIRCUITS. Author(s) Corporate Author(s) RCA SOLID STATE TECHNOLOGY CENTER SOMERVILLE N J Report Date 11/3/1977 Page Count 35 Abstract Wafer fabrication is nearly completed. COS/MOS circuits have beensuccessfully fabricated utilizing sputter etch technology for platinumdefinition. Trimetallization technology with silicon nitride overcoatpassivation, copper beam-tape automated assembly, and silicone molding compoundhas proven to be the best system for fabrication of high reliability low costintegrated circuits. (Author) Price: Available from National Technical Information Service (NTIS). http://www.ntis.gov   Prices are plus sales tax when purchased within New York State and shipping charges, if applicable